International In Mould Labelling & Decoration conference

AWA Conferences & Events is organizing the annual IMLCON™ & IMDCON™ Conference to be held in Phoenix (USA) from 16 th to 18th November, 2011. The conference program includes the IMDA (In Mould Labelling Association) Annual Meeting (on 16th), several technical presentations about in mould labeling technology for packaging and durable goods (on 17th) and a Networking Breakfast Meeting (on 19th). During the Conference, participants will have the opportunity to visit a concurrent IML/IMD exhibition and to attend the IMDA Award ceremony. For more information, Click here. AWA invites brand owners to attend and will provide them complimentary participation. For registration, information and questions, brand owners can contact Steven Eijkelenburg at AWA via conferences@awa-bv.com or call +31 20 676 2069.

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Hygienic and Decorative Packaging of Dairy Products

At Interpack 2011 (Düsseldorf, May 12 – 18), ILLIG will present innovative and economical technology concepts for food packs manufactured by thermoforming. The newly designed FSL 48 form, fill and seal line will be presented there for the first time to demonstrate the compliance with hygiene class IV according to VDMA for filling and packaging. At the same time packs with brilliant decoration can be realized by employing an also newly developed IML (In-Mold Labeling) station which can be integrated in the production unit. There is a great variety of cup shape options since for IML decoration walls don’t have to be vertical.

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IML competition announced

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The In-Mold Decorating Association proudly announced its Fifth Annual Awards Competition. The 2011 Competition will recognize the industry’s best in-mold labeled packaging and in-mold decorated durable products. The winning entries are chosen based on creativity in design, engineering and innovation in the following categories: Best Part Design, Best Thin Wall Packaging, Best Injection Molded Part, Best Blow Molded Part, Best IMD Durable Product, Best Label Design, Best Product Family (common style or brand).
Entries must be received by June 1, 2011. 
Award winners will be recognized at IMLCON and IMDCON 2011, November 16-17, 2011, in Phoenix, AZ, USA, and will be featured in the October, 2011 issue of Package Design Magazine. Complete entry details, rules and entry form are available here or by contacting Ron Schultz.